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Thursday, May 7, 2020 | History

1 edition of Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications found in the catalog.

Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications

Yosi Shacham-Diamand

Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications

by Yosi Shacham-Diamand

  • 380 Want to read
  • 17 Currently reading

Published by Springer-Verlag New York in New York, NY .
Written in English

    Subjects:
  • Computer engineering,
  • Materials,
  • Chemical engineering,
  • Chemistry,
  • Nanotechnology

  • Edition Notes

    Statementedited by Yosi Shacham-Diamand, Tetsuya Osaka , Madhav Datta, Takayuki Ohba
    ContributionsŌsaka, Tetsuya, 1945-, Datta, Madhav, Ohba, Takayuki, SpringerLink (Online service)
    The Physical Object
    Format[electronic resource] /
    ID Numbers
    Open LibraryOL25554640M
    ISBN 109780387958675, 9780387958682

    3D Interconnect Technology. John U. Knickerbocker. Therefore, to optimize system applications leveraging 3D interconnections, ongoing technical challenges include: (i) 3D system design and architecture, (ii) wafer fabrication with through‐silicon vias (TSVs), (iii) wafer finishing including wafer thinning, thin wafer handling and wafer Cited by: 1. • Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications • Scanning Force Microscopy of Polymers • Molecular Dynamics of Glass -Forming Systems • Organic Electronics • Advances in Polymer Science, book series • Progress in Colloid and Polymer Science, book series.

    Description: In Advanced ULSI interconnects – fundamentals and applications we bring a comprehensive description of copper-based interconnect technology for ultra-lar- scale integration (ULSI) technology for integrated circuit (IC) application. In- grated circuit technology is the base for all modern electronics systems. Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications. $ $ Advanced Organic Chemistry. Part B: Reaction and Synthesis. $ Advanced Organic Chemistry: Part A: Structure and Mechanisms and Applications. $ Crystal Growth of Si for Solar Cells. $ Electroanalytical Methods: Guide to Experiments.

    you'll find more products in the shopping cart. Total € View cart. The unfortunate and serious accident at the nuclear power plants in Fukushima, Japan caused by the earthquake and tsunami in March dealt Japan a serious blow. Japan was nearly deprived of electric power when in response to the accident all nuclear reactors in Japan were shut down. This shortage further accelerated the introduction of renewable energies. This book surveys the new materials.


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Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications by Yosi Shacham-Diamand Download PDF EPUB FB2

Introduction. Advanced Nanoscale ULSI Interconnects: Fundamental and Applications brings a comprehensive description of copper based interconnect technology for Ultra Large Scale Integration (ULSI) technology to Integrated Circuit (ICs) application. This book reviews the basic technologies used today for the copper metallization of ULSI applications: deposition and planarization.

Advanced Nanoscale ULSI Interconnects: Fundamental and Applications brings a comprehensive description of copper based interconnect technology for Ultra Large Scale Integration (ULSI) technology to Integrated Circuit (ICs) : Hardcover.

In Advanced ULSI interconnects – fundamentals and applications we bring a comprehensive description of copper-based interconnect technology for ultra-lar- scale integration (ULSI) technology for integrated circuit (IC) application.

In- grated circuit Manufacturer: Springer. Advanced Nanoscale ULSI Interconnects: Fundamental and Applications brings a comprehensive description of copper based interconnect technology for Ultra Large Scale Integration (ULSI) technology to Integrated Circuit (ICs) application.

In Advanced ULSI interconnects - fundamentals and applications we bring a comprehensive description of copper-based interconnect technology for ultra-lar- scale integration (ULSI) technology for integrated circuit (IC) application. In- grated circuit technology is Price: $ Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications Shacham-Diamand, Yosi Abstract.

Publication: Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications. Pub Date: DOI: /Cited by: Y. Shacham-Diamand et al. (eds.), Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications, DOI /_11, C Springer Science+Business Media, LLC H. Park et al. surrounding materials can influence material transport along the interconnect and affect the overall electromigration characteristics [11–13].

Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications In Advanced ULSI interconnects – fundamentals and applications we bring a comprehensive description of copper-based interconnect technology for ultra-lar- scale integration (ULSI) technology for integrated circuit.

In Advanced ULSI interconnects – fundamentals and applications we bring a comprehensive description of copper-based interconnect technology for ultra-large- scale integration (ULSI) technology for integrated circuit (IC) application.

Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications. pp Schubert S. Chu. Atomic layer deposition (ALD) is a technique where precursors are. Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements.

It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano-interconnects, and discusses.

This book is dedicated to my wife Anat for all hersupport and patience. Preface. In Advanced ULSI interconnects fundamentals and applications we bring acomprehensive description of copper-based interconnect technology for ultra-large-scale integration (ULSI) technology for integrated circuit (IC) application.

NASA/ADS. Advanced BEOL Technology Overview Yoda, T.; Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications. Pub Date: DOI: /_19 Bibcode: full text sources.

Cited by: 1. Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications Tungsten and Other Advanced Metals for ULSI Applications in Volume 6 Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements.

It covers a broad range of topics, from physical principles to design. Abstract. Copper is widely used as interconnecting material in ultra-large-scale integration (ULSI) circuits (Fig. Fabrication of copper interconnection has been achieved by “Damascene process” [1], which is an electrodeposition process combined with chemical–mechanical polishing (CMP) (Fig.

) [2].Cited by: 1. Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications Springer-Verlag New York Y. Shacham-Diamand (auth.), Yosi Shacham-Diamand. A.M. Bittner, „Electroless Deposition Approaching the Molecular Scale“, in „Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications“, Springer A.M.

Bittner, „The Tobacco Mosaic Virus as Template”, in „Handbook of Biomineralization Vol. 2”. Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications.

ISBN Springer-Verlag New York,p. : Abstract Copper is widely used as interconnecting material in ultra-large-scale integration (ULSI) circuits (Fig.

Get this from a library. Advanced nanoscale ULSI interconnects: fundamentals and applications. [Yosi Shacham-Diamand; et al]. Request PDF | Advanced Interconnects for ULSI Technology | Product Information About The Product Finding new materials for copper/low-k interconnects is critical to the continuing development of.

Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano-interconnects, and discusses: Interconnect functions, characterisations.This book provides the reader with knowledge on a wide variety of radiation fields and their effects on the electronic devices and systems.

The author covers faults and failures in ULSI devices induced by a wide variety of radiation fields, including electrons, alpha-rays, muons, gamma rays, neutrons and heavy ions.Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements.

It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano-interconnects, and discusses:Brand: Wiley.